The two principle deposition methods are Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD).
Chemical Vapor Deposition:
CVD is usually a high-temperature process that will produce chemically developed coatings from a prepared gaseous mixture. The substrate material (material being coated) will act as a catalyst during the reaction process at temperature. The process temperature ranges from 1380°F (750°C) up to 1970°F (1060°C).
Physical Vapor Deposition:
PVD is accomplished by the creation of a metal vapor, which is a reactive gas to deposit a hard coat onto the substrate surface being treated. This method of deposition has created the ability to accomplish the deposition at low temperatures ranging from 480°F (250°C) up to 1100°F (600°C).
Watch for my next submission to learn about the delivery methods of both coating techniques.