Mattson Technology Inc. shipped its Helios® XP rapid thermal-processing (RTP) system to a fourth major foundry customer. The Helios XP will be used for the volume production and development of next-generation chips at leading-edge technology nodes. According to Mattson Technology, the Helios XP's patented dual-side heating and differential thermal energy control (DTEC) technology dynamically controls within-die temperature and reduces pattern loading effect to provide unparalleled temperature uniformity and minimized wafer stress for advanced transistor manufacturing. Fremont, Calif.-based Mattson Technology designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits.