The 6th International Quenching and Distortion Conference, hosted by ASM International, will be held Sept. 9-13 at the Radison Blu Aqua Hotel in Chicago, Ill.

Causes for distortion can be found in every step of the manufacturing process, especially when it comes to quenching. Learn methods for reducing distortion through the latest quenching methodologies. You can do the following at this year’s event:
  • Choose from 11 different topic areas over four days of dual-track programming, which includes 97 technical papers (60% from academia/40% from industry)
  • Hear from Keynote Speakers George Totten (“The Power of Twenty Years of Collaboration and Leverage in Addressing Heat Transfer and Distortion") and Tatsuo Inoue ("Transformation Plasticity – The Mechanism, the Experimental and Non-experimental Identification of Characteristics, and the Effect on Metallo-Thermo-Mechanical Simulation of Quenching Processes")
  • Attend the appreciation dinner, during which George Vander Voort will present “Color Metallography”
  • Network with colleagues from 31 countries around the world
The following topics will be covered in this year’s technical program:
  • Agitation measurement and control; Computational fluid dynamics
  • Control and elimination of distortion
  • Equipment design and fixturing
  • Finite element analysis and constitutive equations; Boundary conditions
  • Fundamentals principles
  • Heat transfer as applied to distortion control
  • Material and shape optimization
  • Modeling of processes and phenomena
  • Process methodology to control distortion and residual stresses
  • Quenchants (oil, polymer and other quenchants)
  • Relationship of microstructure and quenching
   
Advertising and custom sponsorship opportunities are still available. Get your company, product or process in front of this niche audience.  Reserve your tabletop and sponsorship today. Contact Kelly Thomas, national account manager, at 440-338-1733 orkelly.thomas@asminternational.org.  

Visit   www.asminternational.org/qcdto register.