Microelectronic Applications

Master Bond, Inc., Hackensack, NJ, has introduced a 4-p application selector guide on adhesives, sealants, coatings, and encapsulants specially formulated for microelectronics. This guide consists of both one and two component systems including expoxies, silicones, acrylics, and latex. Viscosity, set-up times, cure schedules, service operating temperature ranges and application recommendations are listed for 70 different grades.